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Meyer & Burger have built a worldwide reputation for the finest
quality slicing machines available. Their expertise in cutting GLASS, MAGNETIC MATERIALS, SILICON and otherSEMICONDUCTOR MATERIALS is unsurpassed in the industry. There are four types of slicing machines available, |
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Cut material with conventional
peripheral blade . |
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Cut materials with anular blade for
high accuracy and low curf loss |
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Cutting of large ingots into blocks for
subsequent operations. |
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Cut blocks into wafers - very high
yield and accuracy. |
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MEYER BURGER
offer machines for the
total production process from ingot to slice for the silicon, ceramic, magnet and photo voltaic industries. |
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Ceramic rings
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Quartz glass
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Neodym NdFeB
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Silicon
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