Meyer & Burger have built a worldwide reputation for the finest
quality slicing machines available. Their expertise in cutting
GLASS, MAGNETIC MATERIALS, SILICON and
otherSEMICONDUCTOR MATERIALS is unsurpassed in the
industry. There are four types of slicing machines available,
Cut material with conventional
peripheral blade .
Cut materials with anular blade for
high accuracy and low curf loss
Cutting of large ingots into blocks for
subsequent operations.
Cut blocks into wafers - very high
yield and accuracy.
MEYER BURGER
offer machines for the
total production process
from ingot to slice for the
silicon, ceramic, magnet
and photo voltaic
industries.
Ceramic rings
Quartz glass
Neodym NdFeB
Silicon
I. D. Saws